DIN - DVS 3310
Quality requirements in adhesive bonding technology
| Organization: | DIN |
| Publication Date: | 1 February 2012 |
| Status: | active |
| Page Count: | 10 |
| ICS Code (Adhesives): | 83.180 |
scope:
Introduction
This technical code describes the requirements on users who are either planning to use adhesive bonding technology or who are already using adhesive bonding technology. This technical code is not specific to a particular bonding task and can therefore be utilised for all adhesive bonding work.
The technical code is both a guide and an aid for users. It will allow them to make decisions on measures for an in-house quality assurance system for adhesive bonding. These measures will enable them to meet the requirements laid down in regulations or laid down by their customers in contracts.
In order to be able to successfully plan adhesive bonding work, the company management must make the following decisions in advance:
- Confirm that adhesive bonding is to be carried out
- Specify the highest class of bonded joint (see Section 5) that is to be manufactured at the company
- Define the scope of the adhesive bonding process (with regard to the value added at the company)
- Make decisions about what is undertaken in-house and what work is outsourced (e.g. design, purchasing, production, maintenance, etc.)
- Define the relevance of adhesive bonding technology for the company.
The scope of the resulting work must be estimated based on the requirements laid down in this technical code and must be compared with the potential benefits for the company. Adhesive bonding technology can only be successfully used if the company creates the necessary boundary conditions.
In each individual case, the level of operational production quality needed to fulfil the duty of care depends on the features of the product in question.
According to the DIN EN ISO 9000 series for quality assurance systems, adhesive bonding constitutes a "special process".
In order for the bonded products, components or structures to be used as intended, the whole of the bonding process must be monitored. This monitoring must cover the design stage, the selection of the substrates and adhesives, the surface treatment, the application and curing of the adhesive and the testing of the bonded joints. The adhesive bonding processes must be described clearly and any deviations from these processes must be avoided. Monitoring must be carried out in order to ensure that the prescribed quality is attained. In order to guarantee fault-free production and to avoid shortcomings, users of this technical code must employ suitable quality assurance procedures.
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