FORD WRS-M4D941-B1
POLYPROPYLENE (PP) MOLDING COMPOUND, HOMOPOLYMER, HEAT STABILIZED, 30% GLASS FIBER/MICA REINFORCED, RECYCLED GRADE 25% PIR/PCR, NON-VISIBLE APPLICATIONS ***TO BE USED WITH FORD WSS-M99P1111-A***
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Organization: | FORD |
Publication Date: | 9 April 2015 |
Status: | inactive |
Page Count: | 5 |
scope:
The material defined by this specification is a lubricated and heat stabilized 30% glass fiber/mica reinforced thermoplastic injection molding compound.
Document History

July 6, 2023
POLYPROPYLENE (PP) MOLDING COMPOUND, HOMOPOLYMER, HEAT STABILIZED, 30% GLASS FIBER/MICA REINFORCED, 25% RECYCLED MATERIAL BY WEIGHT, NON-VISIBLE APPLICATIONS ***TO BE USED WITH FORD WSS-M99P1111-A***
The material defined by this specification is a lubricated and heat stabilized 30% glass fiber/mica reinforced thermoplastic injection molding compound based on the content listed in the table below.

August 23, 2019
POLYPROPYLENE (PP) MOLDING COMPOUND, HOMOPOLYMER, HEAT STABILIZED, 30% GLASS FIBER/MICA REINFORCED, RECYCLED GRADE 25% PIR/PCR, NON-VISIBLE APPLICATIONS ***TO BE USED WITH FORD WSS-M99P1111-A***
The material defined by this specification is a lubricated and heat stabilized 30% glass fiber/mica reinforced thermoplastic injection molding compound based on the content listed in the table below.

FORD WRS-M4D941-B1
April 9, 2015
POLYPROPYLENE (PP) MOLDING COMPOUND, HOMOPOLYMER, HEAT STABILIZED, 30% GLASS FIBER/MICA REINFORCED, RECYCLED GRADE 25% PIR/PCR, NON-VISIBLE APPLICATIONS ***TO BE USED WITH FORD WSS-M99P1111-A***
The material defined by this specification is a lubricated and heat stabilized 30% glass fiber/mica reinforced thermoplastic injection molding compound.

March 14, 2012
POLYPROPYLENE (PP) MOLDING COMPOUND, HOMOPOLYMER, HEAT STABILIZED, 30% GLASS FIBER/MICA REINFORCED, RECYCLED GRADE 25% PIR/PCR, NON-VISIBLE APPLICATIONS ***TO BE USED WITH FORD WSS-M99P1111-A***
The material defined by this specification is a lubricated and heat stabilized 30% glass fiber/mica reinforced thermoplastic injection molding compound.