CENELEC - EN 61189-2-721
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 June 2015 |
| Status: | active |
| Page Count: | 28 |
| ICS Code (Printed circuits and boards): | 31.180 |
scope:
This part of IEC 61189 outlines a way to determine the relative permittivity ( εr) and loss tangent (tan δ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates at microwave frequencies (from 1,1 GHz to 20 GHz) using a split post dielectric resonator (SPDR).
This part of IEC 61189 is applicable to copper clad laminates and dielectric base materials.
Document History
EN 61189-2-721
June 1, 2015
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of relative permittivity and loss tangent for copper clad laminate at microwave frequency using split post dielectric resonator
This part of IEC 61189 outlines a way to determine the relative permittivity ( εr) and loss tangent (tan δ) (also called dielectric constant (Dk) and dissipation factor (Df)) of copper clad laminates...