DIN EN 62047-27
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) (IEC 47F/216/CD:2015)
inactive, Most Current
| Organization: | DIN |
| Publication Date: | 1 August 2015 |
| Status: | inactive |
| Page Count: | 26 |
| ICS Code (Electromechanical components in general): | 31.220.01 |
| ICS Code (Semiconductor devices in general): | 31.080.01 |
Document History
DIN EN 62047-27
August 1, 2015
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT) (IEC 47F/216/CD:2015)
A description is not available for this item.