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DSF/FPREN 62047-27

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

pending, Most Current
Organization: DS
Status: pending
Page Count: 17
scope:

This International Standard specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides guidance for the design of deviating sample geometries. The micro-chevron-test is an experimental method to determine the fracture toughness KIC of brittle materials or bond interfaces using specifically designed test chips (micro-chevron132 samples) under defined load conditions (crack opening mode I). Owing to its high precision and low variance it is suitable for analysing the influence of different process parameters on bond strength as well as for quality assurance. The exemplary setup of the micro-chevron-test is given in Figure 1.

Document History

DSF/FPREN 62047-27
Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)
This International Standard specifies a method for assessing the bond strength of glass frit bonded structures using micro-chevron-tests (MCT). It describes suitable sample geometry and provides...
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