scope:

A comprehensive guide to TSV and other enabling technologies for 3D integration. Written by an expert with more than 30 years of experience in the electronics industry, Through-Silicon Vias for 3D Integration provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to high-performance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed. This book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems. Coverage includes:

• Nanotechnology and 3D integration for the semiconductor industry

• TSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing

• TSVs: mechanical, thermal, and electrical behaviors

• Thin-wafer strength measurement

• Wafer thinning and thin-wafer handling

• Microbumping, assembly, and reliability

• Microbump electromigration

• Transient liquid-phase bonding: C2C, C2W, and W2W

• 2.5D IC integration with interposers

• 3D IC integration with interposers

• Thermal management of 3D IC integration

• 3D IC packaging

Author: John H. Lau, Ph.D.