ECIA - 540GA00
Blank Detail Specification for Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings for Use in Electronic Equipment
|Publication Date:||1 January 1993|
The Burn-In Sockets of assessed quality covered by this Detail Specification shall have:
a) Maximum enclosure (maximum length, width, and height dimensions).
b) A working voltage not exceeding _ volts (rms).
c) Current not exceeding _ ampere per pin.
The object of this Detail Specification is to provide all information required for the identification and quality assessment of the Burn-In Sockets for Chip Carrier Packages with Molded Carrier Rings. The sockets have solder tail leads. The information contained herein or by reference, is complete and sufficient for inspection purposes.