loading
IEC 60747-14-4 - Semiconductor devices – Discrete devices – Part 14-4: Semiconductor accelerometers
January 1, 2011 - IEC

This part of IEC 60747 applies to semiconductor accelerometers for all types of products. This standard applies not only to typical semiconductor accelerometers with built-in electric circuits, but also to semiconductor accelerometers accompanied by external circuits. This...

DS/EN 60749-37 - Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer
May 14, 2008 - DS

This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The...

DSF/PREN IEC 60749-37 - Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
DS

This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The...

CEI EN 60749-40 - Semiconductor devices - Mechanical and climatic test methods Part 40: Board level drop test method using a strain gauge
July 1, 2012 - CEI

This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test...

DS/EN 60749-40 - Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
October 14, 2011 - DS

This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test...

IEC 60749-40 - Semiconductor devices – Mechanical and climatic test methods – Part 40: Board level drop test method using a strain gauge
July 1, 2011 - IEC

This part of IEC 60749 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test...

BS IEC 60747-14-4 - Semiconductor devices - Discrete devices Part 14-4: Semiconductor accelerometers
February 28, 2011 - BSI
A description is not available for this item.
Advertisement