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MIL-C-50679 - CIRCUIT BOARD ASSEMBLY, AGC: 10549230
NPFC
A description is not available for this item.
JIS B 8461 - PCB (printed circuit board) assembly robots - Interfaces
February 20, 2002 - JSA
A description is not available for this item.
JIS B 0144 - PCB (printed circuit board) assembly robots - Vocabulary
December 20, 2000 - JSA
A description is not available for this item.
JIS B 8462 - PCB (printed circuit board) assembly robots - Safety
December 20, 2000 - JSA
A description is not available for this item.
MIL-P-60504 - PRINTED CIRCUIT BOARD ASSEMBLY Q-SWITCH TIMING
NPFC
A description is not available for this item.
IPC-7912 - End-Item DPMO for Printed Circuit Board Assemblies
January 1, 2004 - IPC

This document is intended to define standard methods for the categorization of defects related to electronic printed board assemblies (PBAs). This document will provide consistent methodologies for calculating the following benchmark indices: • Defects Per Million Opportunities Index...

MIL-C-70574 - CIRCUIT BOARD ASSEMBLY, BUILT IN TEST 2A8 UNIT 2: 9361010
NPFC
A description is not available for this item.
MIL-G-50680 - GATE CIRCUIT, MULTIPLE BOARD ASSEMBLY - UPPER: 9342753
NPFC
A description is not available for this item.
MIL-G-50681 - GATE CIRCUIT, MULTIPLE, BOARD ASSEMBLY - LOWER: 10548550
NPFC
A description is not available for this item.
JIS B 8460 - PCB (printed circuit board) assembly robots - Presentation of characteristics and functions
February 20, 2002 - JSA
A description is not available for this item.
DIN EN 16602-70-28 - Space product assurance - Repair and modification of printed circuit board assemblies for space use; English version EN 16602-70-28:2014
June 1, 2015 - DIN

The requirements and procedures for repair and modification detailed in this Standard are designed to maintain the rigorous standards set by the customer for the manufacture and assembly of space-quality printed circuit boards. This Standard is confined to the repair and modification...

IPC-HDBK-850 - Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
July 1, 2012 - IPC

For the purpose of this document potting can be thought of as the ''liquid material'' and encapsulation can be interpreted as the application process and cure. Please keep in mind however that the terms potting and encapsulation are commonly interchanged with each other in a variety of electronic...

MIL-C-50652/18 - CIRCUIT CARD, ASSEMBLY: 10549234 (BOARD, UNIVERSAL
NPFC
A description is not available for this item.
MIL-C-48583 - CIRCUIT CARD ASSEMBLY TARGET ACCELERATION BOARD
NPFC
A description is not available for this item.
MIL-C-50790/2 - CIRCUIT CARD ASSEMBLY, 12004303 (REGULATOR BOARD)
NPFC
A description is not available for this item.
MIL-C-48582 - CIRCUIT CARD ASSEMBLY, TARGET POSITION BOARD, 11747198
NPFC
A description is not available for this item.
MIL-C-48581 - CIRCUIT CARD ASSEMBLY: 11747210 TARGET COINCIDENCE BOARD
NPFC
A description is not available for this item.
IEC 60194 - Printed board design, manufacture and assembly - Terms and definitions
April 1, 2015 - IEC

This International Standard defines the terminology used in the field of printed circuit boards and printed circuit board assembly products.

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