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AMS2422 - GOLD PLATING
January 15, 1958 - SAE International
A description is not available for this item.
EIA CB 12 - Gold Plating Study Test Report
January 1, 1990 - ECIA

The purpose of this study is to evaluate the performance characteristics of gold plating thicknesses when exposed to a severe series of environmental sequences. phenomenon which could potentially cause contact interface degradation. The program is designed to stress the component...

MIL-G-14548 - GOLD PLATING (ELECTRODEPOSITED)
November 3, 1959 - NPFC
A description is not available for this item.
MIL-G-45204 - GOLD PLATING, ELECTRODEPOSITED
NPFC
A description is not available for this item.
MIL-DTL-45204 - GOLD PLATING, ELECTRODEPOSITED
NPFC
A description is not available for this item.
AMS2425D - GOLD PLATING For Thermal Control
May 1, 1993 - SAE International

This specification covers the engineering requirements for electrodeposition of gold on metals and the properties of the deposit.

AMS2425C - GOLD PLATING For Thermal Control
October 1, 1984 - SAE International

This specification covers the engineering requirements for electrodeposition of gold on metals and the properties of the deposit.

AMS2425B - GOLD PLATING For Thermal Control
July 1, 1976 - SAE International

This specification covers the engineering requirements for electrodeposition of gold on metals and the properties of the deposit.

AMS2425A - GOLD PLATING For Thermal Control
April 1, 1967 - SAE International
A description is not available for this item.
AMS2422A - GOLD PLATING For Electronic Applications
March 15, 1966 - SAE International
A description is not available for this item.
AMS2425 - GOLD PLATING For Thermal Control
March 1, 1966 - SAE International
A description is not available for this item.
SEMI G8 - TEST METHOD FOR GOLD PLATING
SEMI
A description is not available for this item.
AMS2422F - Plating, Gold
July 15, 2019 - SAE International

This specification covers the requirements for electrodeposited gold plate.

AMS2422E - Plating, Gold
April 24, 2007 - SAE International

This specification covers the engineering requirements for electrodeposition of gold and the properties of the deposit.

AMS2422D - PLATING, GOLD
November 1, 1994 - SAE International

This specification covers the engineering requirements for electrodeposition of gold and the properties of the deposit.

AMS2422C - GOLD PLATING For Electronic and Electrical Applications
October 1, 1991 - SAE International

This specification covers the engineering requirements for electrodeposition of gold and the properties of the deposit.

AMS2422B - GOLD PLATING For Electronic and Electrical Applications
October 15, 1980 - SAE International

This specification covers the engineering requirements for electrodeposition of gold and the properties of the deposit.

AMS2425F - Plating, Gold for Thermal Control
July 15, 2019 - SAE International

This specification covers the requirements for gold deposited on metal surfaces and the properties of the deposit.

AMS2425E - Plating, Gold For Thermal Control
September 28, 2006 - SAE International

This specification covers the requirements for gold deposited on metal surfaces and the properties of the deposit.

IPC-4552 - Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
August 1, 2017 - IPC

Statement of Scope This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers,...

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