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EIA CB 12 - Gold Plating Study Test Report
January 1, 1990 - ECIA

The purpose of this study is to evaluate the performance characteristics of gold plating thicknesses when exposed to a severe series of environmental sequences. phenomenon which could potentially cause contact interface degradation. The program is designed to stress the component...

MIL-G-14548 - GOLD PLATING (ELECTRODEPOSITED)
November 3, 1959 - NPFC
A description is not available for this item.
MIL-DTL-45204 - GOLD PLATING, ELECTRODEPOSITED
NPFC
A description is not available for this item.
MIL-G-45204 - GOLD PLATING, ELECTRODEPOSITED
NPFC
A description is not available for this item.
SAE AMS2422 - Plating, Gold
February 1, 2014 - SAE

Form This specification covers the requirements for electrodeposited gold plate. Application This plating has been used typically to improve the solderability, electrical conductivity, corrosion resistance, performance, and appearance of electronic and electrical parts, but usage is...

SEMI G8 - TEST METHOD FOR GOLD PLATING
SEMI
A description is not available for this item.
SAE AMS2425 - Plating, Gold for Thermal Control
December 1, 2012 - SAE

Purpose This specification covers the requirements for gold deposited on metal surfaces and the properties of the deposit. Application This process has been used typically for passive thermal control applications where high reflectance and low absorptance of solar radiation are required, but...

IPC-4552 - Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards
August 1, 2017 - IPC

Statement of Scope This performance specification sets requirements for Electroless Nickel/Immersion Gold (ENIG) deposit thicknesses for applications including soldering, wire bonding and as a contact finish. It is intended for use by chemical suppliers, printed board manufacturers,...

IPC-4552 GERMAN - Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards
October 1, 2002 - IPC

This specification sets the requirements for the use of Electroless Nickel/Immersion Gold (ENIG) as a surface finish for printed circuit boards. This specification is intended to set requirements for ENIG deposit thicknesses based on performance criteria. It is intended for use by supplier,...

SAE AMS03-17 - Electro-Deposition of Gold
February 1, 2018 - SAE

This SAE Standard specifies the requirements for the electro-deposition of gold on ferrous-base materials, copperbase materials, aluminum-base materials, zinc-base materials and nickel-base materials for MOD use. It is primarily intended for use on electrical and electronic items which are...

DEF STAN 03-17 - Electro-Deposition of Gold
April 30, 2007 - MODUK

This Standard specifies the requirements for the electro-deposition of gold on ferrous-base materials, copper-base materials, aluminium-base materials, zinc-base materials and nickel-base materials for MOD use. It is primarily intended for use on electrical and electronic items which are to...

GMW3044 - Zinc Plating
October 1, 2017 - GMW

Material Description. This coating system must be free of hexavalent chromium, per GMW3059 requirements. The plating shall be shown on the part drawing. Table 1 lists the common plating thickness codes covered by this specification. It is recommended to use these common codes to avoid...

SAE AMS2418 - Plating, Copper
March 1, 2017 - SAE

Form This specification covers the requirements for electrodeposited copper. Application This process has been used typically to provide an anti-seize surface, to prevent carburizing of surfaces on which carburizing is neither required or permitted, to prevent decarburization, to enhance...

SAE AMS2460 - Plating, Chromium
March 1, 2013 - SAE

Purpose This specification covers the requirements for electrodeposited chromium plating. Application This plating has been used typically as a decorative finish, to improve corrosion resistance, to increase wear resistance, to extend tool and die life, to maintain accuracy of gauges,...

EIA CB 13 - X-Ray Fluorescence for Measuring Plating Thickness
January 1, 1990 - ECIA

PURPOSE There are a number of techniques currently being used for measuring plating thickness. All have peculiar application and also limitations, Basic economics, however, demands that for measuring gold thicknesses in the commonly used plating thickness ranges, a system must...

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