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IEEE HIGH-SPEED LOGIC - HIGH-PERFORANCE SYSTEM DESIGN - CIRCUITS AND LOGIC
IEEE
A description is not available for this item.
TIA-613 - High Speed Serial Interface for Data Terminal Equipment and Data Circuit- Terminating Equipment
November 1, 1993 - TIA

Section Abstracts This standard is applicable to the interconnection of data terminal equipment (DTE) and data circuit-terminating equipment (DCE) employing serial binary data interchange with control information exchanged on separate control circuits. It defines: Section 2 Normative...

VITA 17.3 - Serial Front Panel Data Port (sFPDP) Gen 3.0
January 1, 2018 - VITA

This standard defines VITA 17.3 "Serial FPDP Gen 3.0" (sFPDP), a high-speed serial communications interface. Included in this definition are various user data framing methods, supported system configurations, and the Link Layer Protocol.

MPIF HIGH TEMPERATURE - High Temperature Sintering
January 1, 1990 - MPIF
A description is not available for this item.
IEEE HIGH-PERFORMANCE SYS - HIGH-PERFORMANCE SYSTEM DESIGN: CIRCUITS AND LOGIC
IEEE
A description is not available for this item.
IEEE HIGH-PERFORM.SYSTEMS - HIGH-PERFORMANCE SYSTEM DESIGN: CIRCUITS AND LOGIC
IEEE
A description is not available for this item.
IEEE HIGH-TEMPERATURE - HIGH-TEMPERATURE ELECTRONICS
IEEE
A description is not available for this item.
HIGHWAY CAPACITY MANUAL - HIGHWAY CAPACITY MANUAL
TRB
A description is not available for this item.
JEDEC JESD 8-31 - 1.8 V HIGH-SPEED LVCMOS (HS_LVCMOS) INTERFACE
March 1, 2018 - JEDEC

This standard defines the dc and ac input levels, output levels, and input overshoot and undershoot specifications for the 1.8 V High-speed LVCMOS (HS_LVCMOS) interface. The non-terminated interface has a switching range that is nominally expected to be 0 V to 1.8 V.

JEDEC JESD 235 - High Bandwidth Memory DRAM (HBM1, HBM2)
November 1, 2018 - JEDEC

The HBM DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM DRAM uses a...

CEI EN IEC 61162-450 - Maritime navigation and radiocommunication equipment and systems - Digital interfaces Part 450: Multiple talkers and multiple listeners - Ethernet interconnection
February 1, 2019 - CEI

This part of IEC 61162 specifies interface requirements and methods of test for high speed communication between shipboard navigation and radiocommunication equipment as well as between such systems and other ship systems that need to communicate with navigation and...

ITU-T G.998.2 - Ethernet-based multi-pair bonding
November 1, 2018 - ITU-T

This Recommendation specifies portions of clause 61 of [IEEE 802.3ah]-2004 amendment to carrier sense multiple access with collision detection (CSMA/CD) access method and physical layer specification as a normative reference and identifies the requirements for multi-pair bonding in [IEEE 802...

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