Narrow Your Results
This document describes the target, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards. It represents the visual interpretation of minimum requirements set forth in various printed board specifications, e.g.; IPC-6010 series,...
Abstract Conformal coatings are thin layers of polymers applied to the surfaces of electronic assemblies, primarily to protect the electronics from the operational environment. In most manufacturing specifications, conformal coating thickness is defined as the thickness of the final polymer film on...
This standard establishes the requirements for exchanging material and substance data between suppliers and their customers for electrical and electronic products and other products. This standard applies to products, components, subproducts, complex objects, articles, materials, mixtures and...
This standard prescribes practices for the characterization, qualification and acceptance requirements of compliant press-fit technology for printed boards that cover the manufacturability and reliability needs for high reliability applications intended for use in harsh environments such as...
This standard establishes the requirements for exchanging data between suppliers and their customers in regard to the responsible sourcing of minerals. This standard originally addressed conflict minerals within the scope of the Dodd-Frank Act in the US and now addresses global responsible minerals...
This method subjects unpopulated test specimens (samples) to sudden, extreme changes in temperature in order to evaluate the quality of interconnects formed during the manufacturing processes. Purpose This method shall be used to simulate the thermodynamic effects of extreme temperature variations....
This method is intended to simulate exposure to the thermal conditions by convection reflow assembly. Purpose This method shall be used to replicate the thermodynamic effects by assembly on the test specimen. The use of this method is intended to simulate those effects that are the result of...
This standard provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. These trusted sources shall ensure...
This standard prescribes practices and requirements for the manufacture of cable, wire and harness assemblies. This standard does not provide criteria for cross-section or X-ray evaluation. If a conflict occurs between the English and translated versions of this document, the English version will...
This standard establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. The flexible materials used in the structures are comprised of insulating films, reinforced and/or...
