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CRC - TFE1462 - MEMORY, MICROPROCESSOR, AND ASIC Organization: CRC
Date: 2003-03-26
Description: Timing, memory, power dissipation, testing, and testability are all crucial elements of VLSI circuit design.
CRC - KE11741 - POLYURETHANE SHAPE MEMORY POLYMERS Organization: CRC
Date: 2011-09-08
Description: Shape memory polymers (SMPs) are some of the most important and valuable engineering materials developed in the last 25 years.
JEDEC JESD 82-20 - FBDIMM ADVANCED MEMORY BUFFER (AMB) Organization: JEDEC
Date: 2009-03-01
Description: This document is a core specification for a Fully Buffered DIMM (FBD) memory system. This document, along with the other core specifications, must be treated as a whole.
PACKT - OBJECTIVE-C MEMORY MANAGE - OBJECTIVE-C MEMORY MANAGEMENT ESSENTIALS Organization: PACKT
Date: 2015-03-25
Description: This book will ensure that you can actively learn the methods and concepts in relation to memory management in a more engaging way. Basic knowledge of iOS development is required for this book.
BSI - BS EN 61964 - INTEGRATED CIRCUITS - MEMORY DEVICES PIN CONFIGURATIONS Organization: BSI
Date: 1999-09-15
Description: Establishes a registration procedure for pinout package configurations of solid state integrated circuit memory devices.
IEEE 1450.6.2 - MEMORY MODELING IN CORE TEST LANGUAGE (CTL) - IEEE COMPUTER SOCIETY Organization: IEEE
Date: 2014-03-27
Description: This standard defines language constructs sufficient to represent the context of a memory core and of the integration of that memory core into an SoC. This facilitates the development and reuse of test and repair mechanisms for memories.
NR - BR 1911 ISSUE A - SOLID STATE INTERLOCKING PROCESSOR MEMORY MODULE MKII Organization: NR
Date: 1991-01-01
Description: Five options are detailed in Appendix 2: BR1911A-1  SSI MPM Extended Memory BR1911A-2 DWS MPM Extended Memory BR1911A-3 SSI PPM Standard Memory (equivalent to BR1911-3) BR1911A-4 DWS PPM Standard Memory ( equivalent to BR1911-4) BR1911A-5 SSI MPM Standard Memory (equivalent to BR1911-1) The front plate shall carry a label, as defined in Section 8 of this specification.
DS/ISO/IEC 11693 - IDENTIFICATION CARDS - OPTICAL MEMORY CARDS - GENERAL CHARACTERISTICS Organization: DS
Date: 2005-12-05
Description: This International Standard provides information necessary to store data on cards, to read data from cards, and for the physical, optical, and data interchangeability of optical memory cards in information processing systems. It defines the general characteristics of optical memory cards including card materials, construction, characteristics, dimensions, and test environments which have been determined to be common to all types of optical memory cards regardless of recording method employed.
CSA ISO/IEC 11693 - IDENTIFICATION CARDS - OPTICAL MEMORY CARDS - GENERAL CHARACTERISTICS Organization: CSA
Date: 2006-12-01
Description: This International Standard provides information necessary to store data on cards, to read data from cards, and for the physical, optical, and data interchangeability of optical memory cards in information processing systems. It defines the general characteristics of optical memory cards including card materials, construction, characteristics, dimensions, and test environments which have been determined to be common to all types of optical memory cards regardless of recording method employed.
CRC - SILICON BASED UNIFIED MEM - SILICON BASED UNIFIED MEMORY DEVICES AND TECHNOLOGY Organization: CRC
Date: 2017-06-28
Description: The primary focus of this book is on basic device concepts, memory cell design, and process technology integration.
CRC - KE20624 - NANOSCALE SEMICONDUCTOR MEMORIES : TECHNOLOGY AND APPLICATIONS Organization: CRC
Date: 2013-12-12
Description: Building on this foundation, the coverage turns to STT-RAM, emphasizing scalable embedded STT-RAM, and the physics and engineering of magnetic domain wall "racetrack" memory. The book also discusses state-of-the-art modeling applied to phase change memory devices and includes an extensive review of RRAM, highlighting the physics of operation and analyzing different materials systems currently under investigation.
CRC - NANOSCALE SEMICONDUCTOR M - NANOSCALE SEMICONDUCTOR MEMORIES: TECHNOLOGY AND APPLICATIONS Organization: CRC
Date: 2017-03-29
Description: Building on this foundation, the coverage turns to STT-RAM, emphasizing scalable embedded STT-RAM, and the physics and engineering of magnetic domain wall "racetrack" memory. The book also discusses state-of-the-art modeling applied to phase change memory devices and includes an extensive review of RRAM, highlighting the physics of operation and analyzing different materials systems currently under investigation.
CRC - DKE6037 - MEMORY MANAGEMENT FOR SYNTHESIS OF DSP SOFTWARE Organization: CRC
Date: 2006-03-20
Description: The data-rich, computation-intensive nature of DSP makes memory management a chief and challenging concern for designers. Memory Management for Synthesis of DSP Software focuses on minimizing memory requirements during the synthesis of DSP software from dataflow representations.
DS/EN 61964 - INTEGRATED CIRCUITS - MEMORY DEVICES PIN CONFIGURATIONS Organization: DS
Date: 2001-08-20
Description: This standard applies to pinout package configurations of solid state integrated circuit memory devices. The purpose of this standard is to establish a registration procedure for such configurations.
NAVY - MIL-M-28787/316A - MODULES, STANDARD ELECTRONIC MEMORY, READ ONLY, DIGITAL Organization: NAVY
Date: 1983-01-20
Description: This document establishes the requirements and test procedures for the acquisition of an electronic digital read only memory module. This specification covers two classes of modules.
IETF RFC 5040 - A REMOTE DIRECT MEMORY ACCESS PROTOCOL SPECIFICATION Organization: IETF
Date: 2007-10-01
Description: This document defines a Remote Direct Memory Access Protocol (RDMAP) that operates over the Direct Data Placement Protocol (DDP protocol).
ARMY - MIL-C-70567B - CIRCUIT BOARD, COMPUTER AND MEMORY: 9360878 Organization: ARMY
Date: 1994-05-02
Description: This specification covers the requirements, examinations and tests for the fire control processor computer and memory circuit card assembly, referred to as the computer and memory board (CMB). The CMB is used to compute ballistics calculations and communicate with the servo control processor input/output board and data transmission board.
CEN - EN 16603-50-52 - SPACE ENGINEERING - SPACEWIRE - REMOTE MEMORY ACCESS PROTOCOL Organization: CEN
Date: 2014-09-01
Description: To distinguish between the various protocols a protocol identifier is used, as specified in ECSS-E-ST-50-51. This Standard specifies the Remote Memory Access protocol (RMAP), which is one of these protocols that works over SpaceWire.
DS/EN 16603-50-52 - SPACE ENGINEERING - SPACEWIRE - REMOTE MEMORY ACCESS PROTOCOL Organization: DS
Date: 2014-09-22
Description: To distinguish between the various protocols a protocol identifier is used, as specified in ECSS-E-ST-50-51. This Standard specifies the Remote Memory Access protocol (RMAP), which is one of these protocols that works over SpaceWire.
TSE - TS ISO/IEC 11693 - IDENTIFICATION CARDS- OPTICAL MEMORY CARDS- GENERAL CHARACTERISTICS Organization: TSE
Date: 2002-03-27
Description: characteristics of optical memory cards including cardmaterials, construction, characteristics, dimensions and testenvironments common to all types of optical cards regardless ofrecording method employed.

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