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IEEE CMOS MEMORY CIRCUITS - CMOS MEMORY CIRCUITS AND ARCHITECTURES
IEEE
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Shape Memory Materials
May 14, 2018 - CRC

This work addresses the basic principles, synthesis / fabrication and applications of smart materials, specifically shape memory materials. Based on origin, the mechanisms of transformations vary in different shape memory materials and are discussed in different chapters under titles...

DS/ISO/IEC TS 19841 - Technical Specification for C++ Extensions for Transactional Memory
November 12, 2018 - DS

ISO/IEC TS 19841:2015 describes extensions to the C++ Programming Language (1.3) that enable the specification of Transactional Memory. These extensions include new syntactic forms and modifications to existing language and library. The International Standard, ISO/IEC 14882, provides...

Nanocrystals in Nonvolatile Memory
September 13, 2018 - CRC
A description is not available for this item.
ISO DIS 24497-1 - Non-destructive testing - Metal magnetic memory - Part 1: Vocabulary and general requirements
November 6, 2018 - ISO

This document specifies terms and definitions for non-destructive testing by the technique of metal magnetic memory (MMM) as well as general requirements for application of this technique of the magnetic testing method. The terms specified in this document are mandatory for application in...

ISO DIS 24497-2 - Non-destructive testing - Metal magnetic memory - Part 2: Inspection of welded joints
November 6, 2018 - ISO

This document specifies general requirements for the application of the non-destructive metal magnetic memory (MMM) testing technique of the magnetic testing method for quality assurance of welded joints. This document may be applied to welded joints in any type of ferromagnetic products:...

JEDEC JESD 235 - High Bandwidth Memory DRAM (HBM1, HBM2)
November 1, 2018 - JEDEC

The HBM DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM DRAM uses a wide-interface architecture to...

Apache Ignite Quick Start Guide
November 30, 2018 - PACKT

Build efficient, high-performance & scalable systems to process large volumes of data with Apache Ignite Key Features *Understand Apache Ignite's in-memory technology *Create High-Performance app components with Ignite *Build a real-time data streaming and complex event processing system...

SMD 5962-81035 - MICROCIRCUIT, MEMORY, DIGITAL, BIPOLAR PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
November 26, 2018 - DOD

This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

JEDEC JESD 216 - Serial Flash Discoverable Parameters (SFDP)
November 1, 2018 - JEDEC

The SFDP standard defines the structure of the SFDP database within the memory device and methods used to read its data. The JEDEC-defined header with Parameter ID FF00h and the related Basic Parameter Table is mandatory. This header and table provide basic information for a Serial...

Learn Microsoft Azure
December 26, 2018 - PACKT

Explore various Azure services to build solutions that leverage effective design patterns Key Features *Create, deploy, and host cloud applications on Azure *Understand various Azure services that help you host serverless applications *Explore practical examples to help you secure and troubleshoot...

Hands-On System Programming with Linux
October 31, 2018 - PACKT

Get up and running with system programming concepts in Linux Key Features *Acquire insight on Linux system architecture and its programming interfaces *Get to grips with core concepts such as process management, signalling and pthreads *Packed with industry best practices and dozens of code...

SMD 5962-90965 - MICROCIRCUIT, MEMORY, DIGITAL, CMOS, FIELD PROGRAMMABLE GATE ARRAY, 2,000 GATES, MONOLITHIC SILICON
November 26, 2018 - DOD

This drawing documents two product assurance class levels consisting of high reliability (device class Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of...

Hands-On System Programming with C++
December 26, 2018 - PACKT

"A hands-on guide to making system programming with C++ easy Key Features *Write system-level code leveraging C++17 *Learn the internals of the Linux Application Binary Interface (ABI) and apply it to system programming *Explore C++ concurrency to take advantage of server-level constructs Book...

Deep Learning with PyTorch Quick Start Guide
December 24, 2018 - PACKT

"Introduction to deep learning and PyTorch by building a convolutional neural network and recurrent neural network for real-world use cases such as image classification, transfer learning, and natural language processing. Key Features *Clear and concise explanations*Gives important insights into...

Modern C++: Efficient and Scalable Application Development
December 21, 2018 - PACKT

"Create apps in C++ and leverage its latest features using modern programming techniques.Key Features *Develop strong C++ skills to build a variety of applications *Explore features of C++17, such as containers, algorithms, and threads *Grasp the standard support for threading and concurrency and...

SMD 5962-15225 - MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 2M x 48- BIT (96M), RADIATION-HARDENED, FLOW-THRU, SYNCHRONOUS SRAM (SSRAM), MONOLITHIC SILICON
November 13, 2018 - DOD

This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of...

SMD 5962-93091 - MICROCIRCUIT, HYBRID, MEMORY, 512K X 8-BIT, ELECTRICALLY ERASABLE PROGRAMMABLE READ ONLY MEMORY
October 23, 2018 - DOD

This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are...

Kotlin for Enterprise Applications using Java EE
November 30, 2018 - PACKT

"Build Java Enterprise Applications and learn how Kotlin makes it easier to code them using components like JSF 2.3, Enterprise JavaBeans (EJB) 3.2, Contexts and Dependency Injection (CDI) 2.0, the Java API for WebSockets, JAX-RS 2.1, Servlet 4.0.Key Features *An in-depth guide updated with all the...

Recurrent Neural Networks with Python Quick Start Guide
November 30, 2018 - PACKT

Learn how to develop intelligent applications with sequential learning and apply modern methods for language modeling with neural network architectures for deep learning with Python's most popular TensorFlow framework. Key Features *Train and deploy Recurrent Neural Networks using the popular...

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