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IEEE CMOS MEMORY CIRCUITS - CMOS MEMORY CIRCUITS AND ARCHITECTURES
IEEE
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ASTM E3097-23 - Standard Test Method for Uniaxial Constant Force Thermal Cycling of Shape Memory Alloys
June 15, 2023 - ASTM International

5.1 Constant force thermal cycling tests determine the effect of stress on the transformation temperatures, recovered strain and residual strain of a shape memory alloy. The tests may be for one thermal cycle. A standard test method for force controlled repeated thermal cycling of shape...

ARP7998 - Shared Memory Interface for Gas Turbine Engine Performance Programs
March 23, 2023 - SAE International

This is an initial release of a recommended practice for an interface to supplier simulations that utilize traditional inter-process communication (IPC) methods of shared memory and semaphore communications. These IPC methods are standard practice in the computer science world and allow for...

ASTM F1387-23 - Standard Specification for Performance of Piping and Tubing Mechanically Attached Fittings
July 1, 2023 - ASTM International

This specification establishes the performance characteristics required for mechanically attached fittings (MAFs) for use in piping and tubing systems. These fittings directly attach to pipe or tube by mechanical deformation of the pipe or tube or fitting, or a combination thereof, creating a seal...

ASTM E2956-23 - Standard Guide for Monitoring the Neutron Exposure of LWR Reactor Pressure Vessels
September 1, 2023 - ASTM International

4.1 Regulatory Requirements-The USA Code of Federal Regulations (10CFR Part 50, Appendix H) requires the implementation of a reactor vessel materials surveillance program for all operating LWRs. Other countries have similar regulations. The purpose of the program is to (1) monitor changes in the...

AS6802A - Time-Triggered Ethernet
February 14, 2023 - SAE International

This SAE Aerospace Standard (AS) defines a fault-tolerant synchronization strategy for building and maintaining synchronized time in a distributed system of end systems and switches (we use the term "end system" for data terminal equipment (DTE), as specified in IEEE 802.3), which can be used to...

ASTM E1948-98(2022) - Standard Guide for Analytical Data Interchange Protocol for Chromatographic Data
November 1, 2022 - ASTM International

6.1 General Coding Guidelines-The NetCDF libraries are supplied to developers as source code. End users receive the libraries in compiled binary form as part of a vendor's application. 6.1.1 Some vendors found that compilation using the huge memory model under Microsoft Windows on MS-DOS was...

J1939/73_202208 - Application Layer - Diagnostics
August 5, 2022 - SAE International

SAE J1939-73 defines the SAE J1939 messages to accomplish diagnostic services and identifies the diagnostic connector to be used for the vehicle service tool interface. Diagnostic messages (DMs) provide the utility needed when the vehicle is being repaired. Diagnostic messages are also used during...

ASTM F3508-21a - Standard Guide for In-Situ Pipeline Renovation As Dual-Wall Composite Pipeline by Push/Pull Installation of Compressed-Fit Shape-Memory-Polymer Tubular (SMPT)
November 1, 2021 - ASTM International

1.1 This guide describes the specification and re-construction of in-situ pipelines and conduits 2 in. to 63 in. (50 mm to 1600 mm) diameter) by the pulled-in-place installation, into an existing conduit, of circular, radially reduced, Shape-Memory-Polymer Tubular (SMPT) that after...

ASTM F2005 - Standard Terminology for Nickel-Titanium Shape Memory Alloys
March 1, 2021 - ASTM

This terminology is a compilation of definitions of terms used in ASTM documents relating to nickel-titanium shape memory alloys used for medical devices. This terminology includes only those terms for whichASTM either has standards or which are used inASTM standards for nickel-titanium...

ASTM F2005-21 - Standard Terminology for Nickel-Titanium Shape Memory Alloys
March 1, 2021 - ASTM International

1.1 This terminology is a compilation of definitions of terms used in ASTM documents relating to nickel-titanium shape memory alloys used for medical devices. This terminology includes only those terms for which ASTM either has standards or which are used in ASTM standards for...

ASTM F3508-21 - Standard Guide for In-Situ Pipeline Re-Construction As Coupled Dual-Wall Composite Pipeline by Push/Pull Installation of Compressed-Fit Shape-Memory-Polymer Tubular (SMPT)
August 1, 2021 - ASTM International

1.1 This guide describes the the specification and re-construction of in-situ pipelines and conduits 2 in. to 63 in. (50 mm to 1600 mm) diameter) by the pulled-in-place installation, into an existing conduit, of circular, radially reduced, Shape-Memory-Polymer Tubular (SMPT) that after...

JEDEC JESD 235 - High Bandwidth Memory DRAM (HBM1, HBM2)
February 1, 2021 - JEDEC

The HBM DRAM is tightly coupled to the host compute die with a distributed interface. The interface is divided into independent channels. Each channel is completely independent of one another. Channels are not necessarily synchronous to each other. The HBM DRAM uses a wide-interface architecture to...

Linux Kernel Programming
March 19, 2021 - PACKT

Learn how to write high-quality kernel module code, solve common Linux kernel programming issues, and understand the fundamentals of Linux kernel internalsKey Features* Discover how to write kernel code using the Loadable Kernel Module framework* Explore industry-grade techniques to perform...

JEDEC JEP 301-1 - SYSTEM LEVEL ROWHAMMER MITIGATION
March 1, 2021 - JEDEC

A DRAM rowhammer security exploit is a serious threat to cloud service providers, data centers, laptops, smart phones, self-driving cars and IoT devices. Hardware research and development will take time. DRAM components, DRAM DIMMs, System-on-chip (SoC), chipsets and system products have their own...

CSA ISO/IEC 15962 - Information technology — Radio frequency identification (RFID) for item management — Data protocol: data encoding rules and logical memory functions
January 1, 2021 - CSA

The data protocol used to exchange information in an RFID system for item management is specified in ISO/IEC 15961 and in this International Standard. Both International Standards are required for a complete understanding of the data protocol in its entirety; but each focuses on one particular...

SMD 5962-86859 - MICROCIRCUIT, MEMORY, DIGITAL, CMOS 16K X 4 SRAM, MONOLITHIC SILICON
February 18, 2021 - DOD

Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

SMD 5962-87651 - MICROCIRCUIT, MEMORY, DIGITAL, CMOS, 1K X 8 PROGRAMMABLE READ ONLY MEMORY (PROM),MONOLITHIC SILICON
April 15, 2021 - DOD

Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

DS/EN IEC 63047 - Nuclear instrumentation – Data format for list mode digital data acquisition used in radiation detection and measurement
February 16, 2021 - DS

This document specifies the format of binary list-mode data at the output of digital data acquisition devices used for the detection and measurement of radiation. Such data acquisition devices may employ digital signal processors (DSP) and field-programmable gate arrays (FPGA) in combination with...

SMD 5962-88724 - MICROCIRCUIT, MEMORY, DIGITAL, CMOS UV ERASABLE, PROGRAMMABLE LOGIC ARRAY, MONOLITHIC SILICON
March 31, 2021 - DOD

Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A.

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