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1.1 This classification system covers liquid crystal polymeric (LCP) materials suitable for injection molding and extrusion. This classification system allows the use of liquid crystal polymers that are recycled, reconstituted, recycled-regrind, recovered, or reprocessed, or a combination thereof,...
1.1 This practice intends to provide standardized approaches and criteria for the observation and reporting of defects in various types of plastic film, by means of an optical scanning system. Scope includes the in situ inspection of defects in films fabricated for specific applications...
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This part of IEC 61076 describes 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing (hereinafter referred to as a connector) for electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics,...
This part of IEC 61076 describes 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing (hereinafter referred to as a connector) for electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics,...
This part of IEC 61076 describes 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing (hereinafter referred to as a connector) for electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics,...
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This part of IEC 60749 provides a means of assessing the resistance to soldering heat of semiconductors packaged as plastic encapsulated surface mount devices (SMDs). This test is destructive.
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple...
1.1 This practice intends to provide standardized approaches and criteria for the observation and reporting of defects in various types of plastic film, by means of an optical scanning system. Scope includes the in situ inspection of defects in films fabricated for specific applications as...
IEC 61076-8-100:2020 describes 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing (hereinafter referred to as a connector) for electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics,...
IEC 61076-8-102:2020 describes 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing (hereinafter referred to as a connector) for electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics,...
IEC 61076-8-101:2020 describes 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing (hereinafter referred to as a connector) for electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics,...
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple...
This part of IEC 60749 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple...
This part of IEC 61076 describes 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing (hereinafter referred to as a connector) for electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics,...
This part of IEC 61076 describes 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing (hereinafter referred to as a connector) for electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics,...
This part of IEC 61076 describes 2-pole or 3-pole power plus 2-pole signal shielded and sealed connectors with plastic housing (hereinafter referred to as a connector) for electrical and electronic equipment, including overall dimensions, interface dimensions, technical characteristics,...
