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IEC 60068-2-20

Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads

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Organization: IEC
Publication Date: 1 March 2021
Status: active
Page Count: 46
ICS Code (Environmental testing): 19.040
scope:

This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58.

This document provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys.

The procedures in this document include the solder bath method and soldering iron method.

The objective of this document is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can be resistant to the heat load to which it is exposed during soldering.

NOTE Information about wetting time and wetting force can be obtained by test methods using a wetting balance. IEC 60068-2-69 (solder bath and solder globule method) can be consulted.

Document History

IEC 60068-2-20
March 1, 2021
Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
IEC 60068-2-20
July 1, 2008
Environmental testing – Part 2-20: Tests – Test T: Test methods for solderability and resistance to soldering heat of devices with leads
This standard is applicable to all electrical and electronic components liable to be submitted to the tests described below.
IEC 60068-2-20
January 1, 1979
Basic Environmental Testing Procedures Part 2: Tests - Test T: Soldering
This standard is applicable to all electrical and electronic components liable to be submitted to the tests described below.

References

This document references:
IEC 60068-2-2 - Environmental testing – Part 2-2: Tests – Test B: Dry heat
Published by IEC on July 1, 2007
INTRODUCTION General This publication deals with dry heat tests applicable both to heat-dissipating and non heat-dissipating specimens. For non heat-dissipating specimens, Tests Ba and Bb do not...
This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
IEC 60068-2-66 - Environmental Testing - Part 2: Test Methods - Test Cx: Damp Heat, Steady State (Unsaturated Pressurized Vapour)
Published by IEC on June 1, 1994
This International Standard provides a standard test procedure for the purpose of evaluating, in an accelerated manner, the resistance of small electrotechnical products, primarily non-hermetically...
This document references:
IEC 60068-2-69 - Environmental testing – Part 2-69: Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by IEC on June 1, 2019
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
This document is referenced by:
DNVGL-RP-0584 - Design, development and operation of floating solar photovoltaic systems
Published by DNVGL on March 1, 2021
A description is not available for this item.
This document is referenced by:
BS EN 61071 - Capacitors for power electronics
Published by BSI on February 29, 2008
A description is not available for this item.
This document is referenced by:
IEC 61753-111-08 - Fibre optic interconnecting devices and passive components – Performance standard – Part 111-08: Sealed closures for category G – Ground
Published by IEC on April 1, 2021
This part of IEC 61753 contains the minimum tests, test severities and measurement requirements which a sealed fibre optic closure need to meet in order to be categorised as meeting the IEC standard...
This document is referenced by:
CEI IEC/TS 62933-3-1 - Electrical energy storage (EES) systems Part 3-1: Planning and performance assessment of electrical energy storage systems - General specification
Published by CEI on February 1, 2021
This part of IEC 62933 is applicable to EES systems designed for grid-connected indoor or outdoor installation and operation. This document considers • necessary functions and capabilities of EES...
This document is referenced by:
EN IEC 60664-1 - Insulation coordination for equipment within low-voltage supply systems Part 1: Principles, requirements and tests
Published by CEI on July 1, 2023
A description is not available for this item.
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