JEDEC JESD 213
Standard Test Method Utilizing X-Ray Fluorescence (XRF) for Analyzing Component Finishes and Solder Alloys to Determine Tin (Sn) – Lead (Pb) Content
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| Organization: | JEDEC |
| Publication Date: | 1 April 2017 |
| Status: | active |
| Page Count: | 14 |
scope:
This Standard establishes the instrumentation, techniques, criteria, and methods to be utilized to quantify the amount of Lead (Pb) in Tin-Lead (Sn-Pb) alloys and electroplated finishes containing at least 3 weight percent (wt%) Lead (Pb) using X-Ray Fluorescence (XRF) equipment.
Document History
JEDEC JESD 213
April 1, 2017
Standard Test Method Utilizing X-Ray Fluorescence (XRF) for Analyzing Component Finishes and Solder Alloys to Determine Tin (Sn) – Lead (Pb) Content
This Standard establishes the instrumentation, techniques, criteria, and methods to be utilized to quantify the amount of Lead (Pb) in Tin-Lead (Sn-Pb) alloys and electroplated finishes containing at...
March 1, 2010
Common Test Method for Detecting Component Surface Finish Materials
This document is intended to be used by Original Component Manufacturers who deliver electronic components and Original Equipment Manufacturers who are the platform system integrators. It is intended...