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BSI - BS PD IEC TS 62647-4

Process management for avionics – Aerospace and defence electronic systems containing lead-free solder Part 4: Ball grid array (BGA) re-balling

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Organization: BSI
Publication Date: 30 April 2018
Status: active
Page Count: 44
ICS Code (Production. Production management): 03.100.50
ICS Code (Electronic components in general): 31.020
ICS Code (Aerospace electric equipment and systems): 49.060

Document History

BS PD IEC TS 62647-4
April 30, 2018
Process management for avionics – Aerospace and defence electronic systems containing lead-free solder Part 4: Ball grid array (BGA) re-balling
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References

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