scope:

This standard applies to single-, dual- and triple-chamber temperature cycling in an air or other gaseous medium and covers component and solder interconnection testing. In single chamber cycling, the load is placed in a stationary chamber and is heated or cooled by introducing hot or cold air into the chamber. In dual-chamber cycling, the load is placed on a moving platform that shuttles between stationary chambers maintained at fixed temperatures. In triple-chamber temperature cycling there are three chambers and the load is moved between them. (This standard does not cover thermal shock conditions that leverage fast ramp rates commonly associated with thermal energy liquid coupling media used by thermal shock chambers.)

This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.