IPC-SM-785
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
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| Organization: | IPC |
| Publication Date: | 1 November 1992 |
| Status: | active |
| Page Count: | 58 |
scope:
This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments of electronic assemblies. Background and design information is provided for an understanding of the accelerated test issues.
Document History
IPC-SM-785
November 1, 1992
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests...