UNLIMITED FREE
ACCESS
TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC-SM-785

Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments

active, Most Current
Buy Now
Organization: IPC
Publication Date: 1 November 1992
Status: active
Page Count: 58
scope:

This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests towards actual use environments of electronic assemblies. Background and design information is provided for an understanding of the accelerated test issues.

 

Document History

IPC-SM-785
November 1, 1992
Guidelines for Accelerated Reliability Testing of Surface Mount Solder Attachments
This document provides guidelines for accelerated reliability testing of surface mount solder attachments and for evaluating and extrapolating the results of these accelerated reliability tests...

References

Advertisement