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IPC-S-816

SMT Process Guideline and Checklist

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Organization: IPC
Publication Date: 1 July 1993
Status: active
Page Count: 46
scope:

This document is intended to provide guidelines and assistance in performing and troubleshooting the steps involved in the process of producing printed wiring assemblies incorporating surface mounting attachment of components.

Each section contains a list of problems ofien observed during a specific part of the surface mount assembly process. The list of observed symptoms is matched by a description of causes often acsociated with the symptoms. Suggestions for correction are also included. These solutions may be related to the equipment, materials, or design. Accordingly, some of these corrective measures cannot be implemented on the shop floor.

 

Document History

IPC-S-816
July 1, 1993
SMT Process Guideline and Checklist
This document is intended to provide guidelines and assistance in performing and troubleshooting the steps involved in the process of producing printed wiring assemblies incorporating surface...

References

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