UNLIMITED FREE ACCESS TO THE WORLD'S BEST IDEAS

close
Already an Engineering360 user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your Engineering360 Experience

close
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

IPC - J-STD-003

Solderability Tests for Printed Boards

active, Most Current
Buy Now
Organization: IPC
Publication Date: 1 April 2014
Status: active
Page Count: 48
scope:

This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes (PTHs). This standard is intended for use by both user and supplier.

This standard is not intended to verify the potential of successful processing at assembly or to evaluate design impact on wettability. This standard describes procedures or methods to determine the acceptable wettability of a surface finish. Wettability can be affected by handling, finish application, and environmental conditions.

Purpose This standard describes solderability determinations that are made to verify that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed board intended to be soldered. Reference coupons or representative portions of a printed board may be used. Solderability is determined by evaluation of a test specimen which has been processed as part of a panel of boards and subsequently removed for testing per the method selected.

Document History

J-STD-003
April 1, 2014
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
April 1, 2014
Solderability Tests for Printed Boards
A description is not available for this item.
January 1, 2014
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
September 1, 2013
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes....
March 1, 2007
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This...
February 1, 2003
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This...
January 1, 1992
Solderability Tests for Printed Boards
This standard prescribes the recommended test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated...

References

Advertisement