IPC - J-STD-003
Solderability Tests for Printed Boards
|Publication Date:||1 January 1992|
This standard prescribes the recommended test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated through-holes. This standard is intended for use by both vendor and user.
Purpose The solderability determination is made to verib that the printed board fabrication processes and subsequent storage have had no adverse effect on the solderability of those portions of the printed wiring board intended to be soldered. This is determined by evaluation of the solderability specimen portion of a board or representative coupon which has been processed as part of the panel of boards and subsequently removed for testing per the method selected.