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IPC - SF-818

General Requirements for Electronic Soldering Fluxes

inactive, Most Current
Organization: IPC
Publication Date: 1 February 1988
Status: inactive
Page Count: 24

Document History

SF-818
February 1, 1988
General Requirements for Electronic Soldering Fluxes
A description is not available for this item.

References

This document is referenced by:
IPC-TR-582 - Cleaning and Cleanliness Testing Program Test Results for: Phase 3 - Low Solids Fluxes and Pastes Processed in Ambient Air
Published by IPC on November 1, 1994
INTRODUCTION Chlorofluorocarbon (CFC) compounds have been identified as agents contributing to the reduction of stratospheric ozone. In 1986, many nations of the world signed and ratified the...
This document is referenced by:
IPC-SM-780 - Component Packaging and Interconnecting with Emphasis on Surface Mounting
Published by IPC on July 1, 1988
This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and...
This document is referenced by:
IPC-FA-251 - Assembly Guidelines for Single-Sided and Double- Sided Flexible Printed Circuits
Published by IPC on February 1, 1992
This document provides guidelines for the assembly of components and mounting hardware to single-and double-sided flexible printed wiring. In addition, the guidelines describe the type of materials...
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