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IPC-SM-780

Component Packaging and Interconnecting with Emphasis on Surface Mounting

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Organization: IPC
Publication Date: 1 July 1988
Status: active
Page Count: 168
scope:

This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and interconnection substrates necessary for sophisticated electronic assemblies.

 

Document History

IPC-SM-780
July 1, 1988
Component Packaging and Interconnecting with Emphasis on Surface Mounting
This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and...

References

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