IPC-SM-780
Component Packaging and Interconnecting with Emphasis on Surface Mounting
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| Organization: | IPC |
| Publication Date: | 1 July 1988 |
| Status: | active |
| Page Count: | 168 |
scope:
This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and interconnection substrates necessary for sophisticated electronic assemblies.
Document History
IPC-SM-780
July 1, 1988
Component Packaging and Interconnecting with Emphasis on Surface Mounting
This document provides guidelines for surface mounting electronic parts, and for intermixing surface and through-the-board mounting techniques. In addition, it describes the types of materials and...