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IPC - J-STD-003

Solderability Tests for Printed Boards

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Organization: IPC
Publication Date: 1 April 2014
Status: inactive
Page Count: 16

Document History

J-STD-003D
October 1, 2022
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes (PTHs)....
J-STD-003
April 1, 2014
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
J-STD-003
April 1, 2014
Solderability Tests for Printed Boards
A description is not available for this item.
J-STD-003
January 1, 2014
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes...
J-STD-003
September 1, 2013
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions, and illustrations for assessing the solderability of printed wiring board surface conductors, attachment lands, and plated-through holes....
J-STD-003
March 1, 2007
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This...
J-STD-003
February 1, 2003
Solderability Tests for Printed Boards
This standard prescribes test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated-through holes. This...
J-STD-003
January 1, 1992
Solderability Tests for Printed Boards
This standard prescribes the recommended test methods, defect definitions and illustrations for assessing the solderability of printed board surface conductors, attachment lands, and plated...
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References

This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
J-STD-004 - Requirements for Soldering Fluxes
Published by IPC on November 1, 2011
A description is not available for this item.
This document references:
T-50N - Terms and Definitions for Interconnecting and Packaging Electronic Circuits
Published by IPC on November 1, 2021
This document is designed to provide definitions for terms commonly used in the electronics industry. The definitions are intended to provide sufficient clarity of detail such that a reader utilizing...
This document references:
J-STD-006 - Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications Amendment 1
Published by IPC on October 1, 2017
A description is not available for this item.
This document references:
J-STD-005 - Requirements for Soldering Pastes
Published by IPC on February 1, 2012
This standard prescribes general requirements for the characterization and testing of solder pastes used to make high quality electronic interconnections. This specification is a material quality...
This document is referenced by:
IPC-6012 REDLINE - Qualification and Performance Specification for Rigid Printed Boards
Published by IPC on September 1, 2015
Statement of Scope This specification establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Purpose The purpose of this specification is...
This document is referenced by:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document is referenced by:
IEC PAS 61249-8-5 - Qualification and performance specification of permanent solder mask and flexible cover materials
Published by IEC on June 1, 2014
This specification shall define the criteria for and method of obtaining the maximum information about and confidence in cured permanent solder mask and cover material under evaluation with the...
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