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IEC 61191-1

Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

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Organization: IEC
Publication Date: 1 September 2018
Status: active
Page Count: 94
ICS Code (Electronic component assemblies): 31.190
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

Document History

IEC 61191-1
September 1, 2018
Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
May 1, 2013
Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
August 1, 1998
Printed Board Assemblies - Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies
This specification prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mounted and related assembly...

References

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