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BSI - BS EN 61191-3

Printed Board Assemblies Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies

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Organization: BSI
Publication Date: 30 September 2017
Status: active
Page Count: 28
ICS Code (Printed circuits and boards): 31.180
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

BS EN 61191-3
September 30, 2017
Printed Board Assemblies Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies
A description is not available for this item.
January 15, 1999
Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies
Applies to assemblies that are totally lead and hole, through-hole mounting technology (THT), or to the THT portions of assemblies that include other related technologies.

References

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