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BSI - BS EN 61191-3

Printed Board Assemblies Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies

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Organization: BSI
Publication Date: 30 September 2017
Status: active
Page Count: 28
ICS Code (Printed circuits and boards): 31.180
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

BS EN 61191-3
September 30, 2017
Printed Board Assemblies Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies
A description is not available for this item.
BS EN 61191-3
January 15, 1999
Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies
Applies to assemblies that are totally lead and hole, through-hole mounting technology (THT), or to the THT portions of assemblies that include other related technologies.

References

This document references:
EN ISO 9001 - Quality management systems - Requirements
Published by CEN on September 1, 2015
This International Standard specifies requirements for a quality management system when an organization: a) needs to demonstrate its ability to consistently provide products and services that meet...
This document references:
EN 60068-2-58 - Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by CENELEC on May 1, 2015
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD). This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
EN 61188-5-1 - Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Published by CENELEC on October 1, 2002
A description is not available for this item.
This document references:
EN 61193-3 - Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Published by CENELEC on April 1, 2013
This part of IEC 61193 establishes sampling plans for inspection by attributes, including sample plan selection criteria and implementation procedures for printed board and laminate end-product and...
This document references:
EN 61193-3 - Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
Published by CENELEC on April 1, 2013
This part of IEC 61193 establishes sampling plans for inspection by attributes, including sample plan selection criteria and implementation procedures for printed board and laminate end-product and...
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