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BSI - BS EN 61191-3

Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies

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Organization: BSI
Publication Date: 15 January 1999
Status: inactive
Page Count: 18
ICS Code (Printed circuits and boards): 31.180
scope:

Applies to assemblies that are totally lead and hole, through-hole mounting technology (THT), or to the THT portions of assemblies that include other related technologies.

Document History

BS EN 61191-3
September 30, 2017
Printed Board Assemblies Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies
A description is not available for this item.
BS EN 61191-3
January 15, 1999
Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies
Applies to assemblies that are totally lead and hole, through-hole mounting technology (THT), or to the THT portions of assemblies that include other related technologies.

References

This document references:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document references:
EN IEC 61191-1 - Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by CENELEC on November 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document is referenced by:
BS EN 61193-1 - Quality Assessment Systems - Part 1: Registration and Analysis of Defects on Printed Board Assemblies
Published by BSI on May 6, 2002
A description is not available for this item.
This document is referenced by:
BS EN 61192-2 - Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
Published by BSI on June 25, 2003
A description is not available for this item.
This document is referenced by:
BS EN IEC 60068-2-20 - Environmental testing Part 2-20: Tests — Test Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by BSI on May 31, 2021
A description is not available for this item.
This document is referenced by:
BS EN 61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by BSI on June 30, 2014
A description is not available for this item.
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