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CENELEC - EN IEC 61191-1

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

active, Most Current
Organization: CENELEC
Publication Date: 1 November 2018
Status: active
Page Count: 50
ICS Code (Electronic component assemblies): 31.190
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly technologies. This part of IEC 61191 also includes recommendations for good manufacturing processes.

Document History

EN IEC 61191-1
November 1, 2018
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
EN 61191-1
August 1, 2013
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
EN 61191-1
October 1, 1998
Printed Board Assemblies Part 1: Generic Specification - Requirements for Soldered Electrical and Electronic Assemblies Using Surface Mount and Related Assembly Technologies
A description is not available for this item.

References

This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
This document references:
IEC 60721-3-1 - Classification of environmental conditions – Part 3-1: Classification of groups of environmental parameters and their severities – Storage
Published by IEC on February 1, 2018
This part of IEC 60721 classifies the groups of environmental parameters and their severities to which products together with their packaging, if any, are subjected when stored. The environmental...
This document is referenced by:
BS EN 61191-2 - Printed Board Assemblies Part 2: Sectional Specification - Requirements for Surface Mount Soldered Assemblies
Published by BSI on October 31, 2017
A description is not available for this item.
This document is referenced by:
BS EN IEC 60068-2-82 - Environmental testing Part 2-82: Tests - Test Xw1: Whisker test methods for components and parts used in electronic assemblies
Published by BSI on July 31, 2019
A description is not available for this item.
This document is referenced by:
BS EN IEC 61188-6-4 - Printed boards and printed board assemblies - Design and use Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design
Published by BSI on July 31, 2019
A description is not available for this item.
This document is referenced by:
BS EN 61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by BSI on June 30, 2014
A description is not available for this item.
This document is referenced by:
BS EN 61191-3 - Printed Board Assemblies Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies
Published by BSI on September 30, 2017
A description is not available for this item.
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