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BSI - BS EN 61190-1-2

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

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Organization: BSI
Publication Date: 30 June 2014
Status: active
Page Count: 26
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN 61190-1-2
June 30, 2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
July 31, 2007
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
August 12, 2002
Attachment Materials for Electronic Assembly Part 1-2: Requirements for Solder Pastes for High-Quality Interconnections in Electronic Assembly
A description is not available for this item.

References

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