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BSI - BS EN 61191-4

Printed board assemblies Part 4: Sectional specification - Requirements for terminal soldered assemblies

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Organization: BSI
Publication Date: 30 November 2017
Status: active
Page Count: 26
ICS Code (Mechanical structures for electronic equipment): 31.240

Document History

BS EN 61191-4
November 30, 2017
Printed board assemblies Part 4: Sectional specification - Requirements for terminal soldered assemblies
A description is not available for this item.
BS EN 61191-4
January 15, 1999
Printed Board Assemblies - Part 4: Sectional Specification - Requirements for Terminal Soldered Assemblies
Applies to assemblies that are totally terminal/wire interconnecting structures, or to the terminal/wire portions of assemblies that include other related technologies.

References

This document references:
IEC 61190-1-2 - Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by IEC on February 1, 2014
A description is not available for this item.
This document references:
IEC 61191-1 - Printed board assemblies – Part 1: Generic specification – Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
Published by IEC on September 1, 2018
This part of IEC 61191 prescribes requirements for materials, methods and verification criteria for producing quality soldered interconnections and assemblies using surface mount and related assembly...
This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
IEC 60068-2-58 - Environmental testing – Part 2-58: Tests – Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by IEC on July 1, 2017
This part of IEC 60068 outlines test Td, applicable to surface mounting devices (SMD) This document provides procedures for determining the solderability, resistance to dissolution of metallization...
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