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IEC 61190-1-2

Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

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Organization: IEC
Publication Date: 1 February 2014
Status: active
Page Count: 50
ICS Code (Electronic component assemblies): 31.190

Document History

IEC 61190-1-2
February 1, 2014
Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
April 1, 2007
Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
March 1, 2002
Attachmant Materials for Electronic Assembly - Part 1-2: Requirements for Solder Pastes for High-Quality Interconnections in Electronics Assembly
A description is not available for this item.

References

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