IEC 61190-1-2
Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
active, Most Current
Buy Now
| Organization: | IEC |
| Publication Date: | 1 February 2014 |
| Status: | active |
| Page Count: | 50 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
IEC 61190-1-2
February 1, 2014
Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
April 1, 2007
Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
March 1, 2002
Attachmant Materials for Electronic Assembly - Part 1-2: Requirements for Solder Pastes for High-Quality Interconnections in Electronics Assembly
A description is not available for this item.