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IEC 61190-1-2

Attachmant Materials for Electronic Assembly - Part 1-2: Requirements for Solder Pastes for High-Quality Interconnections in Electronics Assembly

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Organization: IEC
Publication Date: 1 March 2002
Status: inactive
Page Count: 44
ICS Code (Electronic component assemblies): 31.190

Document History

February 1, 2014
Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
April 1, 2007
Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
IEC 61190-1-2
March 1, 2002
Attachmant Materials for Electronic Assembly - Part 1-2: Requirements for Solder Pastes for High-Quality Interconnections in Electronics Assembly
A description is not available for this item.
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