IEC 61190-1-2
Attachmant Materials for Electronic Assembly - Part 1-2: Requirements for Solder Pastes for High-Quality Interconnections in Electronics Assembly
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Organization: | IEC |
Publication Date: | 1 March 2002 |
Status: | inactive |
Page Count: | 44 |
ICS Code (Electronic component assemblies): | 31.190 |
Document History
February 1, 2014
Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
April 1, 2007
Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
A description is not available for this item.
IEC 61190-1-2
March 1, 2002
Attachmant Materials for Electronic Assembly - Part 1-2: Requirements for Solder Pastes for High-Quality Interconnections in Electronics Assembly
A description is not available for this item.