BSI - BS EN 61190-1-1
Attachment Materials for Electronic Assembly Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
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Organization: | BSI |
Publication Date: | 16 August 2002 |
Status: | active |
Page Count: | 26 |
ICS Code (Electronic component assemblies): | 31.190 |
Document History
BS EN 61190-1-1
August 16, 2002
Attachment Materials for Electronic Assembly Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
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