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BSI - BS EN 61190-1-1

Attachment Materials for Electronic Assembly Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly

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Organization: BSI
Publication Date: 16 August 2002
Status: active
Page Count: 26
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN 61190-1-1
August 16, 2002
Attachment Materials for Electronic Assembly Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
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References

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