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BSI - BS EN 60068-2-58

Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

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Organization: BSI
Publication Date: 31 May 2015
Status: active
Page Count: 46
ICS Code (Electronic component assemblies): 31.190
ICS Code (Environmental testing): 19.040

Document History

BS EN 60068-2-58
May 31, 2015
Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
May 31, 2015
Environmental testing Part 2-58: Tests Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
November 19, 2004
Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
November 19, 2004
Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
July 15, 1999
Environmental Testing - Part 2-58: Tests - Test Td: Test Methods for Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
A description is not available for this item.

References

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