UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

New! AI Engineering Assistant 
- Trained on our vast library of engineering resources.

BSI - BS EN 60068-2-58

Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

active, Most Current
Buy Now
Organization: BSI
Publication Date: 31 May 2015
Status: active
Page Count: 46
ICS Code (Electronic component assemblies): 31.190
ICS Code (Environmental testing): 19.040

Document History

BS EN 60068-2-58
May 31, 2015
Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
BS EN 60068-2-58
May 31, 2015
Environmental testing Part 2-58: Tests Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
BS EN 60068-2-58
November 19, 2004
Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
BS EN 60068-2-58
November 19, 2004
Environmental testing Part 2-58: Tests Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
A description is not available for this item.
BS EN 60068-2-58
July 15, 1999
Environmental Testing - Part 2-58: Tests - Test Td: Test Methods for Solderability, Resistance to Dissolution of Metallization and to Soldering Heat of Surface Mounting Devices (SMD)
A description is not available for this item.

References

This document references:
EN 60068-2-69 - Environmental testing - Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by CENELEC on June 1, 2017
This part of IEC 60068 outlines test Te/Tc, the solder bath wetting balance method and the solder globule wetting balance method to determine, quantitatively, the solderability of the terminations....
This document references:
EN 61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by CENELEC on May 1, 2014
A description is not available for this item.
This document references:
EN IEC 61760-3 - Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Published by CENELEC on March 1, 2021
This part of IEC 61760 gives a reference set of requirements, process conditions and related test conditions to be used when compiling specifications of electronic components that are intended for...
This document references:
EN 61190-1-1 - Attachment Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
Published by CENELEC on June 1, 2002
A description is not available for this item.
This document references:
EN 61190-1-1 - Attachment Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
Published by CENELEC on June 1, 2002
A description is not available for this item.
This document is referenced by:
BS EN IEC 60384-21 - Fixed capacitors for use in electronic equipment Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1
Published by BSI on March 31, 2019
A description is not available for this item.
This document is referenced by:
BS EN IEC 62025-2 - High frequency inductive components — Non-electrical characteristics and measuring methods Part 2: Test methods for non-electrical characteristics
Published by BSI on November 30, 2019
A description is not available for this item.
This document is referenced by:
BS EN 60512-16-21 - Connectors for electronic equipment - Tests and measurements Part 16-21: Mechanical tests on contacts and terminations - Test 16u: Whisker test via the application of external mechanical stresses
Published by BSI on July 31, 2012
A description is not available for this item.
This document is referenced by:
DEF STAN 61-021: SUPP 028 - General Specification for Batteries Supplement: 028 : Lithium Sulfur Dioxide Battery 15V 2.0Ah (Nominal) NSN 6135-99-795-4351
Published by MODUK on February 28, 2021
This supplement provides a definitive specification for the electrical, physical, performance and nomenclature requirements for a 15V, 2.0Ah (Nominal) Lithium Sulfur Dioxide battery, NSN...
This document is referenced by:
DEF STAN 61-021: SUPP 45 - General Specification for Batteries Supplement: 45 Alkaline Manganese Battery 6V NSN 6135-99-222-2993
Published by MODUK on January 14, 2018
This supplement provides a definitive specification for the electrical, physical, performance and nomenclature requirements for a 6V Alkaline Manganese battery, NSN 6135-99-222-2993. This supplement...
View Less
View All
Advertisement