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CENELEC - EN 61190-1-1

Attachment Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly

active, Most Current
Organization: CENELEC
Publication Date: 1 June 2002
Status: active
Page Count: 26
ICS Code (Electronic component assemblies): 31.190

Document History

EN 61190-1-1
June 1, 2002
Attachment Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
A description is not available for this item.

References

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