CENELEC - EN 61190-1-1
Attachment Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
active, Most Current
| Organization: | CENELEC |
| Publication Date: | 1 June 2002 |
| Status: | active |
| Page Count: | 26 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
EN 61190-1-1
June 1, 2002
Attachment Materials for Electronic Assembly - Part 1-1: Requirements for Soldering Fluxes for High-Quality Interconnections in Electronics Assembly
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