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BSI - BS EN 62137-4

Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices

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Organization: BSI
Publication Date: 28 February 2015
Status: active
Page Count: 48
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN 62137-4
February 28, 2015
Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices
A description is not available for this item.
February 28, 2015
Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices
A description is not available for this item.

References

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