BSI - BS EN 62137-4
Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices
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| Organization: | BSI |
| Publication Date: | 28 February 2015 |
| Status: | inactive |
| Page Count: | 48 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
February 28, 2015
Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices
A description is not available for this item.
BS EN 62137-4
February 28, 2015
Electronics assembly technology Part 4: Endurance test methods for solder joint of area array type package surface mount devices
A description is not available for this item.