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IEC 62137-3

Electronics assembly technology – Part 3: Selection guidance of environmental and endurance test methods for solder joints

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Organization: IEC
Publication Date: 1 November 2011
Status: active
Page Count: 94
ICS Code (Electronic component assemblies): 31.190
scope:

This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys.

Document History

IEC 62137-3
November 1, 2011
Electronics assembly technology – Part 3: Selection guidance of environmental and endurance test methods for solder joints
This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array...
November 1, 2008
Electronics assembly technology – Selection guidance of environmental and endurance test methods for solder joints
A description is not available for this item.

References

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