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IEC/PAS 62137-3

Electronics assembly technology – Selection guidance of environmental and endurance test methods for solder joints

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Organization: IEC
Publication Date: 1 November 2008
Status: inactive
Page Count: 46
ICS Code (Electronic component assemblies): 31.190

Document History

November 1, 2011
Electronics assembly technology – Part 3: Selection guidance of environmental and endurance test methods for solder joints
This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array...
IEC/PAS 62137-3
November 1, 2008
Electronics assembly technology – Selection guidance of environmental and endurance test methods for solder joints
A description is not available for this item.
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