IEC/PAS 62137-3
Electronics assembly technology – Selection guidance of environmental and endurance test methods for solder joints
inactive
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| Organization: | IEC |
| Publication Date: | 1 November 2008 |
| Status: | inactive |
| Page Count: | 46 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
November 1, 2011
Electronics assembly technology – Part 3: Selection guidance of environmental and endurance test methods for solder joints
This part of IEC 62137 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array...
IEC/PAS 62137-3
November 1, 2008
Electronics assembly technology – Selection guidance of environmental and endurance test methods for solder joints
A description is not available for this item.