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IEC 61191-3

Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies

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Organization: IEC
Publication Date: 1 May 2017
Status: active
Page Count: 24
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Document History

IEC 61191-3
May 1, 2017
Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT...
August 1, 1998
Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies
This standard prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the...

References

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