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IEC 61191-3

Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies

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Organization: IEC
Publication Date: 1 August 1998
Status: inactive
Page Count: 40
ICS Code (Mechanical structures for electronic equipment): 31.240
scope:

This standard prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the THT portions of those assemblies that include other related technologies (i.e. surface mount, chip mounting, terminal mounting).

Document History

May 1, 2017
Printed board assemblies – Part 3: Sectional specification – Requirements for through-hole mount soldered assemblies
This part of IEC 61191 prescribes requirements for lead and hole solder assemblies. The requirements pertain to those assemblies that totally use through-hole mounting technology (THT), or the THT...
IEC 61191-3
August 1, 1998
Printed Board Assemblies - Part 3: Sectional Specification - Requirements for Through-Hole Mount Soldered Assemblies
This standard prescribes requirements for lead and hole solder assembly. The requirements pertain to those assemblies that are totally lead and hole, through-hole mounting technology (THT), or the...

References

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