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BSI - BS EN IEC 61190-1-3

Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications

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Organization: BSI
Publication Date: 31 March 2018
Status: active
Page Count: 50
ICS Code (Electronic component assemblies): 31.190

Document History

BS EN IEC 61190-1-3
March 31, 2018
Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
A description is not available for this item.
BS EN 61190-1-3
July 31, 2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.
BS EN 61190-1-3
July 31, 2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.
BS EN 61190-1-3
August 12, 2002
Attachment Materials for Electronic Assembly Part 1-3: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
A description is not available for this item.

References

This document references:
EN 61189-6 - Test methods for electrical materials, interconnection structures and assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies
Published by CENELEC on August 1, 2006
A description is not available for this item.
This document references:
IEC 61189-5-4 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-4: General test methods for materials and assemblies – Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies
Published by IEC on January 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document references:
IEC 61190-1-2 - Attachment materials for electronic assembly – Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by IEC on February 1, 2014
A description is not available for this item.
This document references:
EN 61189-5-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
Published by CENELEC on March 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document references:
EN 61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies
Published by CENELEC on March 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document is referenced by:
BS EN IEC 62025-2 - High frequency inductive components — Non-electrical characteristics and measuring methods Part 2: Test methods for non-electrical characteristics
Published by BSI on November 30, 2019
A description is not available for this item.
This document is referenced by:
BS EN 60068-2-83 - Environmental testing Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Published by BSI on November 30, 2011
A description is not available for this item.
This document is referenced by:
BS EN 61189-5 - Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
Published by BSI on February 28, 2009
A description is not available for this item.
This document is referenced by:
BS EN 61189-6 - Test methods for electrical materials, interconnection structures and assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies
Published by BSI on September 29, 2006
A description is not available for this item.
This document is referenced by:
BS EN 60749-21 - Semiconductor devices - Mechanical and climatic test methods Part 21: Solderability
Published by BSI on August 31, 2011
A description is not available for this item.
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