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BSI - BS EN 61189-6

Test methods for electrical materials, interconnection structures and assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies

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Organization: BSI
Publication Date: 29 September 2006
Status: active
Page Count: 44
ICS Code (Wires): 29.060.10
ICS Code (Electronic component assemblies): 31.190
ICS Code (Printed circuits and boards): 31.180
ICS Code (Spools. Bobbins): 55.060

Document History

BS EN 61189-6
September 29, 2006
Test methods for electrical materials, interconnection structures and assemblies Part 6: Test methods for materials used in manufacturing electronic assemblies
A description is not available for this item.

References

This document references:
IEC 61189-1 - Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 1: General Test Methods and Methodology
Published by IEC on November 1, 2001
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
This document references:
BS EN ISO 9001 - Quality management systems - Requirements
Published by BSI on September 30, 2015
A description is not available for this item.
This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
EN ISO 9001 - Quality management systems - Requirements
Published by CEN on September 1, 2015
This International Standard specifies requirements for a quality management system when an organization: a) needs to demonstrate its ability to consistently provide products and services that meet...
This document is referenced by:
BS EN 61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by BSI on June 30, 2014
A description is not available for this item.
This document is referenced by:
BS EN 61189-5 - Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
Published by BSI on February 28, 2009
A description is not available for this item.
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