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IEC 61189-1

Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 1: General Test Methods and Methodology

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Organization: IEC
Publication Date: 1 November 2001
Status: active
Page Count: 60
ICS Code (Printed circuits and boards): 31.180
scope:

Scope and object

This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.

Document History

IEC 61189-1
November 1, 2001
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 1: General Test Methods and Methodology
Scope and object This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection...
March 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 1: General Test Methods and Methodology
A description is not available for this item.
March 1, 1997
Test Methods for Electrical Materials, Interconnection Structures and Assemblies - Part 1: General Test Methods and Methodology
A description is not available for this item.

References

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