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IEC 61190-1-3

Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications

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Organization: IEC
Publication Date: 1 December 2017
Status: active
Page Count: 90
ICS Code (Electronic component assemblies): 31.190
scope:

This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.

Special electronic grade solders include all solders which do not fully comply with the requirements of standard solder alloys and solder materials listed herein. Examples of special solders include anodes, ingots, preforms, bars with hook and eye ends, and multiple-alloy solder powders.

Document History

IEC 61190-1-3
December 1, 2017
Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
IEC 61190-1-3
November 1, 2010
Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
IEC 61190-1-3
June 1, 2010
AMENDMENT 1 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications
A description is not available for this item.
IEC 61190-1-3
April 1, 2007
Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications
A description is not available for this item.
IEC 61190-1-3
March 1, 2002
Attachmant Materials for Electronic Assembly - Part 1-3: Requirements for Electronic Grade Solders Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
A description is not available for this item.

References

This document references:
IEC 61189-5-1 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-1: General test methods for materials and assemblies – Guidance for printed board assemblies
Published by IEC on July 1, 2016
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 contains the types of...
This document references:
IEC 61189-5-2 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies
Published by IEC on January 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document references:
IEC 61189-5-3 - Test methods for electrical materials, printed boards and other interconnection structures and assemblies – Part 5-3: General test methods for materials and assemblies – Soldering paste for printed board assemblies
Published by IEC on January 1, 2015
This part of IEC 61189 is a catalogue of test methods representing methodologies and procedures that can be applied to test printed board assemblies. This part of IEC 61189 focuses on test methods...
This document is referenced by:
CEI EN 60068-2-69 - Environmental testing Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by CEI on October 1, 2018
A description is not available for this item.
This document is referenced by:
BS EN 60068-2-69 - Environmental testing Part 2-69 - Tests – Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method
Published by BSI on July 31, 2017
A description is not available for this item.
This document is referenced by:
BS EN 62739-3 - Test method for erosion of wave soldering equipment using molten lead- free solder alloy Part 3: Selection guidance of erosion test methods
Published by BSI on April 30, 2017
A description is not available for this item.
This document is referenced by:
BS EN 60068-2-58 - Environmental testing Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Published by BSI on May 31, 2015
A description is not available for this item.
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