IEC 61190-1-3
Attachmant Materials for Electronic Assembly - Part 1-3: Requirements for Electronic Grade Solders Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
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| Organization: | IEC |
| Publication Date: | 1 March 2002 |
| Status: | inactive |
| Page Count: | 74 |
| ICS Code (Electronic component assemblies): | 31.190 |
Document History
December 1, 2017
Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
November 1, 2010
Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
June 1, 2010
AMENDMENT 1 Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications
A description is not available for this item.
April 1, 2007
Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solders for electronic soldering applications
A description is not available for this item.
IEC 61190-1-3
March 1, 2002
Attachmant Materials for Electronic Assembly - Part 1-3: Requirements for Electronic Grade Solders Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
A description is not available for this item.