UNLIMITED FREE
ACCESS TO THE WORLD'S BEST IDEAS

SUBMIT
Already a GlobalSpec user? Log in.

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

Customize Your GlobalSpec Experience

Select Your Free Newsletters

Industry Newsletters

Select Your Free Product Alerts

Finish!
Privacy Policy

This is embarrasing...

An error occurred while processing the form. Please try again in a few minutes.

New! AI Engineering Assistant 
- Trained on our vast library of engineering resources.

BSI - BS EN 61189-5

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

active, Most Current
Buy Now
Organization: BSI
Publication Date: 28 February 2009
Status: active
Page Count: 68
ICS Code (Printed circuits and boards): 31.180

Document History

BS EN 61189-5
February 28, 2009
Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
A description is not available for this item.

References

This document references:
IEC 60068-2-20 - Environmental testing – Part 2-20: Tests – Tests Ta and Tb: Test methods for solderability and resistance to soldering heat of devices with leads
Published by IEC on March 1, 2021
This part of IEC 60068 outlines Tests Ta and Tb, applicable to devices with leads and leads themselves. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This...
This document references:
IEC 61190-1-3 - Attachment materials for electronic assembly – Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by IEC on December 1, 2017
This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic...
This document references:
ISO 9455-1 - Soft Soldering Fluxes - Test Methods - Part 1: Determination of Non- Volatile Matter, Gravimetric Method (CEN EN 29455-1: 1993)
Published by ISO on January 1, 1990
A description is not available for this item.
This document is referenced by:
BS EN IEC 61190-1-3 - Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
Published by BSI on March 31, 2018
A description is not available for this item.
This document is referenced by:
BS EN 61190-1-2 - Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
Published by BSI on June 30, 2014
A description is not available for this item.
View Less
View All

Related Products

Searching for related products...

Advertisement