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BSI - BS EN 61190-1-3

Attachment Materials for Electronic Assembly Part 1-3: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications

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Organization: BSI
Publication Date: 12 August 2002
Status: inactive
Page Count: 38
ICS Code (Electronic component assemblies): 31.190

Document History

March 31, 2018
Attachment materials for electronic assembly Part 1-3: Requirements for electronic grade solder alloys and fluxed and nonfluxed solid solder for electronic soldering applications
A description is not available for this item.
July 31, 2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.
July 31, 2007
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
A description is not available for this item.
BS EN 61190-1-3
August 12, 2002
Attachment Materials for Electronic Assembly Part 1-3: Requirements for Electronic Grade Solder Alloys and Fluxed and Non-Fluxed Solid Solders for Electronic Soldering Applications
A description is not available for this item.

References

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